Next-generation substrate conductor layer formation "PVD device" - World first! Direct copper deposition.
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond conventional levels!
【Features】 ■ Achieves high productivity equivalent to or greater than conventional methods such as electroless plating through a vacuum process. ■ Enables high-density plasma modification treatment using a new plasma source. ■ Allows for a high-adhesion process through direct copper sputtering onto organic insulators and glass. ■ Realizes film formation on high aspect ratio TH and BVH, which is considered difficult with conventional sputtering. ■ Offers overwhelming cost competitiveness in equipment compared to traditional sputtering devices. 【Adhesion Strength (Peel Strength)】 Non-alkali glass: ~10 Quartz: ~7 Epoxy resin: ~6 Polyimide: ~12
- Company：サーマプレシジョン
- Price：Other
